DT530 Angled Desoldering Iron is designed for through-hole desoldering, pad cleaning, and excess solder removal during SMD rework.
Features:
• Enhanced heating performance and thermal stability reduce downtime while maintaining consistent temperatures for continuous operation.
• Improved Suction Integrity delivers reliable desoldering through enhanced air-tightness.
• A new tip-locking mechanism enables safe tip replacement and prevents accidental drops.
Its angled design makes DT530 the most suitable desoldering iron in the range for use under a magnifying glass, while reducing operator fatigue during extended use.
The fast-change glass solder collector simplifies maintenance and helps keep the tool operating at peak performance.
DT530 is compatible with DDE and DME Control Units* together with MSE Electric Desoldering Module, delivering all the benefits of JBC Most Efficient Soldering System.
*A Station software update is required to use DT530.
The tool uses D530 Tip Range for through-hole desoldering and pad cleaning, with internal diameters from 0.6 to 3 mm (0.024 – 0.118 in).
