Hot-Air Rework Systems

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Thermaltronics
TMT-HA200

Thermaltronics HA200 Hot-Air System

The TMT-HA200 hot air tool can be used for surface mount component removal and reflow on components such as SOIC, CHIP, QFP, PLCC and others.

  • Auto sleep activated when hot air tool is placed in the holder.
  • Lightweight and compact, takes up minimal table space.
  • Large selection of high quality nozzles.
  • Adjustable, easy to use temperature and air control knobs.

TMT-HA200 Specifications:

  • Input Line Voltage: 220-240 VAC
  • Power: 600 Watts
  • Temperature Range: 100°C - 480°C
  • Pump: Turbine Fan
  • Airflow (Max) 35L / min
  • Fuse: 250V 3A
    Size (W x H x D): 112mm x 205mm x 117mm
  • Weight: 2.4 KG
Thermaltronics
TMT-HA600

Thermaltronics HA600 Hot-Air System

The TMT-HA600 hot air tool uses a large diaphragm pump and a high power 1300W heater, designed to work on more difficult applications, in the removal and reflow of surface mount components.

  • Fast heating and temperature recovery
  • Simple controls allows easy adjustment
  • Uses HTN Series Hot Air Nozzles
  • Digital display with easy-to-adjust temp and airflow

TMT-HA600 Specifications:

  • Input Line Voltage: TMT-HA600-1 100-110 VAC
  • TMT-HA600-2 220-240 VAC
  • Power: 1300 Watts
  • Temperature Range: 100 °C - 480 °C
  • Pump: Diaphragm
  • Airflow (Max) 23L / min
  • Fuse: TMT-HA600-1 250V 15A
  • TMT-HA600-2 250V 8A
  • Size (W x H x D): 188mm x 127mm x 246mm
  • Weight: 3.00 KG