Hot-Air Rework Systems

Thermaltronics HA200 Hot-Air System

The TMT-HA200 hot air tool can be used for surface mount component removal and reflow on components such as SOIC, CHIP, QFP, PLCC and others.

  • Auto sleep activated when hot air tool is placed in the holder.
  • Lightweight and compact, takes up minimal table space.
  • Large selection of high quality nozzles.
  • Adjustable, easy to use temperature and air control knobs.

Thermaltronics HA600 Hot-Air System

The TMT-HA600 hot air tool uses a large diaphragm pump and a high power 1300W heater, designed to work on more difficult applications, in the removal and reflow of surface mount components.

  • Fast heating and temperature recovery
  • Simple controls allows easy adjustment
  • Uses HTN Series Hot Air Nozzles
  • Digital display with easy-to-adjust temp and airflow